Synthetic procedures: sol-gel, self-assembly and hydrothermal synthesis, controlled inert atmosphere (glove box) and vacuum synthesis, Langmuir-Blodgett (LB) and Langmuir-Schaefer (LS) techniques, dip- and spin-coating techniques, Chemical Vapor Deposition (CVD), sputtering, organic reactions, intercalation reactions, thermolytic synthetic reactions, solid state reactions, Flame Spray Pyrolysis (FSP), molten quenching (water, splat and roller) techniques, controlled glass crystallization, ISO 5 (Class 100) cleanroom environment experience.

Characterization and processing techniques: TEM/STEM, XPS, AFM, SEM/EDS, micro-Raman and FT-Raman, UV-Vis, PL/PLE, powder XRD, Mid- and Far-FTIR, DTA/DSC/TGA, specific surface area and porosity analysis (nitrogen porosimetry), mercury porosimetry, DLS, ASV, mechanical testings (tensile, compression, bending, hardness), elemental analysis, NMR (basics), EPR (basics), microfluidizer, 2D/3D printing (inkjet, super inkjet, screen, flexo), spray and doctor blade coating, ultra-centrifugation, plasma (UV/ozone) surface treatment, viscometry/rheometry, contact angle (goniometry/tensiometry), profilometry, four-point probe, freeze-drying, probe station and semiconductor analyzer.